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英语翻译钉头缺点及对位偏差(钻孔及电镀后)制程说明钻孔品质的确认\工作内容一般在钻孔后,必须确认钻孔的位置恰当,没有漏钻,钻偏,孔破或内部撕裂的缺点.因此业界常使用的检查设备,
题目详情
英语翻译
钉头缺点及对位偏差(钻孔及电镀后)
制程说明
钻孔品质的确认\
工作内容
一般在钻孔后,必须确认钻孔的位置恰当,没有漏钻,钻偏,孔破或内部撕裂的缺点.因此业界常使用的检查设备,为X光透视装置检查机,以此对电路板的钻孔位置做抽样检查,藉以确认钻孔的区域没有超过铜垫所限制的范围.在孔内质量方面,则必须确认没有过闷的撕裂现象,有铜屑和树脂的撕裂的现象,则会在电镀后呈现所谓的“钉头型缺点” ,过大的钉头会形成未来电路板的质量 信赖度的问题,因此多数产品会对次种缺点作出规格定义.
钉头缺点及对位偏差(钻孔及电镀后)
制程说明
钻孔品质的确认\
工作内容
一般在钻孔后,必须确认钻孔的位置恰当,没有漏钻,钻偏,孔破或内部撕裂的缺点.因此业界常使用的检查设备,为X光透视装置检查机,以此对电路板的钻孔位置做抽样检查,藉以确认钻孔的区域没有超过铜垫所限制的范围.在孔内质量方面,则必须确认没有过闷的撕裂现象,有铜屑和树脂的撕裂的现象,则会在电镀后呈现所谓的“钉头型缺点” ,过大的钉头会形成未来电路板的质量 信赖度的问题,因此多数产品会对次种缺点作出规格定义.
▼优质解答
答案和解析
Nailhead weakness and to deviation(drill a hole and electroplate behind)
Manufacturing process elucidation
Drill a hole quality to really recognize\\
Work contents
Generally after drilling a hole,the position had to confirm to drill a hole is fitting,do not leak to drill,drill to be partial to,the bore breaks or the inner part tear to pieces of weakness.So the industry often uses of check equipments,see through to equip check machine only for the X,drill a hole circuit board position to do sampling to check with this,by drilling a hole by confirmation of district have no exceed the scope limited by copper mat.Then have to confirm and don't lead to tear to pieces phenomenon stuffily at quality aspect inside the bore,the phenomenon there been copper scraps and resin to tear to pieces,then will present so-called"nailhead type weakness" after electroplating,leading the big nailhead will become the problem of[with] quality trust of the circuit board of future,so most products will grow weakness to make a specification definition to the time.
Manufacturing process elucidation
Drill a hole quality to really recognize\\
Work contents
Generally after drilling a hole,the position had to confirm to drill a hole is fitting,do not leak to drill,drill to be partial to,the bore breaks or the inner part tear to pieces of weakness.So the industry often uses of check equipments,see through to equip check machine only for the X,drill a hole circuit board position to do sampling to check with this,by drilling a hole by confirmation of district have no exceed the scope limited by copper mat.Then have to confirm and don't lead to tear to pieces phenomenon stuffily at quality aspect inside the bore,the phenomenon there been copper scraps and resin to tear to pieces,then will present so-called"nailhead type weakness" after electroplating,leading the big nailhead will become the problem of[with] quality trust of the circuit board of future,so most products will grow weakness to make a specification definition to the time.
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